After months of webinars, online contacts and purely virtual events, LPKF is very happy to participate in productronica 2021 and hopes to welcome many trade show visitors.

At the trade show, the technology company will showcase a split-board automation solution that can use lasers to cut filler panels faster and more cost-effectively, and is easy to integrate on the production line. The new and groundbreaking advancement in laser splitting technology makes it possible to obtain excellent quality results at higher cutting speeds. All of this is included in the new system variant of the proven LPKF CuttingMaster 2000 series-the series will be unveiled at the trade show.

In addition, LPKF also showed visitors to the trade show how to manufacture printed circuit boards quickly and easily in an in-house laboratory. For decades, the company has been equipping industrial and scientific laboratories and development centers with circuit board plotters and laser machines for PCB prototyping and SMT application equipment. The LPKF ProtoLaser U4 will be displayed at a trade show as an example of a laser system for prototyping, especially for sensitive materials. The laser system uses a scanner specially developed for electronic laboratories to guide the laser, and its wavelength is in the ultraviolet region. It can be used to make high-tech prototypes-without any other tools, masks or films. 

With space-saving, simple but reliable advanced integrated circuit packaging technology-Active Molded Package (AMP)-LPKF has now participated in the development of the upcoming 6G telecommunications standard.

In the laser plastic welding business unit, LPKF found a lot of overlap with electronics manufacturing-whether it is the welding of PCB shells or the plastic connection that enriches the field of electric vehicle innovation.

In addition, LPKF has a real world first here: With the LPKF system, special LDS materials can now be added. LDS stands for "Laser Direct Structuring" and is the leading process in molded interconnect device technology. With it, conductive traces can be produced directly on the surface of the injection molded part, allowing the direct integration of mechanical and electronic functions into the molded part. With new connectivity possibilities, LPKF paves the way for greater flexibility, miniaturization and functional integration.

LaserMicronics, a division of LPKF, provides services in the field of material microprocessing and laser plastic welding, and will showcase its services at the trade show stand.

As in previous years, visitors to Productronica will find this laser expert in a familiar place at Booth 303 in Hall B2.

After months of webinars, online contacts and purely virtual events, LPKF is very happy to participate in productronica 2021 and hopes to welcome many trade show visitors.

At the trade show, the technology company will showcase a split-board automation solution that can use lasers to cut filler panels faster and more cost-effectively, and is easy to integrate on the production line. The new and groundbreaking advancement in laser splitting technology makes it possible to obtain excellent quality results at higher cutting speeds. All of this is included in the new system variant of the proven LPKF CuttingMaster 2000 series-the series will be unveiled at the trade show.

In addition, LPKF also showed visitors to the trade show how to manufacture printed circuit boards quickly and easily in an in-house laboratory. For decades, the company has been equipping industrial and scientific laboratories and development centers with circuit board plotters and laser machines for PCB prototyping and SMT application equipment. The LPKF ProtoLaser U4 will be displayed at a trade show as an example of a laser system for prototyping, especially for sensitive materials. The laser system uses a scanner specially developed for electronic laboratories to guide the laser, and its wavelength is in the ultraviolet region. It can be used to make high-tech prototypes-without any other tools, masks or films. 

With space-saving, simple but reliable advanced integrated circuit packaging technology-Active Molded Package (AMP)-LPKF has now participated in the development of the upcoming 6G telecommunications standard.

In the laser plastic welding business unit, LPKF found a lot of overlap with electronics manufacturing-whether it is the welding of PCB shells or the plastic connection that enriches the field of electric vehicle innovation.

In addition, LPKF has a real world first here: With the LPKF system, special LDS materials can now be added. LDS stands for "Laser Direct Structuring" and is the leading process in molded interconnect device technology. With it, conductive traces can be produced directly on the surface of the injection molded part, allowing the direct integration of mechanical and electronic functions into the molded part. With new connectivity possibilities, LPKF paves the way for greater flexibility, miniaturization and functional integration.

LaserMicronics, a division of LPKF, provides services in the field of material microprocessing and laser plastic welding, and will showcase its services at the trade show stand.

As in previous years, visitors to Productronica will find this laser expert in a familiar place at Booth 303 in Hall B2.

White paper: With the transition from low-mix to high-mix manufacturing, the need to optimize the throughput of multiple batches of different products is critical to maximize manufacturing output. Total line utilization... View white paper